Electronic gadgets used in day to day life are becoming more and more compact, with increased capabilities and complexities. With the rise in miniaturization requirements, PCBs are required to be denser with smaller outline. Multilayer PCB’s are defined as PCBs that have more than two layers (Top and Bottom component layers). The PCB stackup design plays a major role in the overall functioning of the system. A poorly designed PCB with inappropriately selected materials can degrade the performance.
Multilayer PCBs that make use of high performance materials are more challenging to build. The arrangement of multilayer PCBs should be done with additional care because inefficient layer arrangements may lead to noise and unexpected operational issues.
Multilayer stackup with many layers could lead to high fabrication cost in most cases. However, cost can be balanced by giving consideration to important aspects. This article explores the factors to be considered for manufacturing multilayer PCBs at affordable prices.
Considerations and Benefits
Challenges The following are the challenges in multilayer stackup for complex PCB design:
Cost Reduction Aspects The following are some of the factors that can help reduce the fabrication cost: