Increasing number, type and sizes of Electronic products entering into the market every day is causing need for better efficiency and durability of the product. Highly evolved consumers today are also aware of the technical nuances and reject products that get heated up and become dysfunctional. Considering this high rate of adoption & rejection of electronic products (mobile phones, laptops, tablets, portable devices, etc) manufacturers now give prominence to thermal analysis at the design stage.
Heat dissipation is important requirement for all electronic products and should be considered early in the product development phase. During the design phase, performing thermal analysis using advanced CFD techniques helps to avoid product dysfunctionality by controlling overheating of the product. Most importantly the software also helps to predict temperature and air flow in and around the system, specifying fan details, amount of air to flow across the heat sink and the maximum temperature a component and withstand.
These predictions also enable resource efficient design modifications and virtual model creation on the basis of various tests. Appropriate selection of fan, position and sizes of air vents on the enclosure can also be estimated during the design phase.
There are tremendous short run to long run advantages of using thermal analysis during the design phase. Some of these have been listed below:
Applications: The CFD software can be used in several area’s for example in HVAC (Heat, Ventilation and Cooling), Consumer products, Medical equipment’s, Electronics systems, and Power systems and so on.
CFD Tools: Ansys ICE PACK with Fluent solver, Autodesk Simulation CFD and Mentor Graphics FloTherm.